Scalable Quantum Computing Hardware
Universal Quantum will build a scalable quantum computer, allowing the QEC Project consortium to take a big step towards unlocking the full commercial potential of quantum computers.
A MICROWAVE TRAPPED-ION QUANTUM COMPUTER
Scalable quantum computing hardware is vital to tackle real-world problems and unlock the true potential of this technology. The QEC project will use the scalable quantum computing blueprint pioneered by Universal Quantum to make a scalable quantum computer. This architecture uses individually charged atoms – ions – as its qubits.
Qubits are naturally identical, well isolated from the environment, and easily controllable.
A microchip ideally suited for error correction - enables ion qubits to be moved around for full connectivity
This high connectivity may allow more efficient quantum error correction methods to be used.
This unique design does not require cooling to near absolute zero as with superconducting quantum computers
Instead of complex laser-based technology, quantum information is processed by applying voltages to a microchip analogous to a classical transistor
With a single wafer holding just a few thousand qubits at most, modularity is critical to scale quantum computers
This design uses ultra-fast electric field connections as compared to complex photonic interconnects between quantum computing modules. These modules feature a fully connected trapped ion qubit system and integrated qubit control technology.
These modules feature a fully connected trapped ion qubit system and integrated qubit control technology. This capitalizes on the wealth of expertise that has come out of the development of the silicon microchips used in conventional computers.
To ensure successful long-term and zero-intervention operation of the Quantum Error Corrected Quantum Computer, it must be installed and operated in Extreme High Vacuum (XHV) vacuum system which requires solutions to unique elements such as:
compatible material and sealing selection,
specific gas loads,
magnetic field suppression and stability,
passive pumping configuration with a minimum footprint to control leaks, outgassing and long term permeation
maximum allowable temperature during baking to be <120° C.